Ruggedized PC-Systeme für militärische Applikationen

LUCIUS & BAER GmbH entwickelt und fertigt "ruggedized" Systeme entsprechend Ihren Spezifikationen.

15.0" TFT Ruggedized PC-System [RPCM15]
  • militärisches Notebook für Outdoor-Applikationen
  • 15.0" TFT mit 1.024x768 Pixel, dimmbar
  • PIII CPU mit 700 MHz
  • VGA, LAN, USB, 2.5" Flash-Drive
  • integriertes Keyboard mit 81 Tasten, Silikon-Mausmodul
  • 115 VAC oder 28 VDC
  • IP64
  • -25...+60°C Arbeitstemperatur
  • Vibration und Shock: MIL-STD-810F


Rugged Tablet PC LB RTC1018
System
CPU
Intel® Oak Trail™ Atom 1.5GHz (Z670)
RAM
Max. 2GB DDRII 800 Memory Down
Storage
32GB 1.8-inch Half-Slim SSD Installed
Display
10.1-inch LED Backlight Screen with 5-wire Resistive Touch
Display Resolution
1366 (W) x 768 (H) WXGA
Outdoor Viewable
Transflective plus type
Audio
2 x High Quality Speakers
Communication
Wi-Fi IEEE 802.11 b/g/n and Bluetooth 2.1
RFID
- ISO/IEC 1443A, 1443B, 15693
- Mifare 1K/4K, Ultralight
- NFC-IP1 Protocol
Webcam
1.3 Mega-pixel, audio input (Front Bezel)
2 Mega-pixel, LED auxiliary light (Rear Bezel)
TPM
1 x Compatible with TPM 1.2
Light-Sensor
1
I/O Ports
USB 2.0 Type A
2
Microphone Jack
1
Headphone Jack
1
Docking Connector
1
DC-Jack
1
In Front Control
Power Button
1
Lock Button
1
Wi-Fi Button
1
Navigation Button
4+ Way Navigation button with integrated Enter button
Program Function Button
5
Trigger Button
2 x Barcode buttons (Programmable)
LED Indicator
Power
Storage
Wi-Fi
Mechanical & Environmental
Dimension
277.8 (W) x 206 (H) x 26.5 (D) mm
Weight
1.2kg (2.65lb)
Certifications
CE, FCC, UL, VCCI, CCC; CE/FCC SAR
Operation System
WES 7-WS7E, WES-WS7P
Water/Dust Resistance
IP54 equivalent
Drop
4-ft drop (MIL-STD-810G Method 516.6 Procedure IV)
Mechanical Shock
Operating : 20g, 11ms, Terminal sawtooth.
Non-operating : 40g, 11ms, Terminal sawtooth
Operation Temperature
0°C to +40°C (32°F to 104°F)
Storage Temperature
-20°C to +60°C (-4°F to 140°F)
Humidity
5-90% without condensation
Power Management
Battery
Internal Smart Lithium Polymer Battery, 3800mAh
Power Adapter
AC 100V ~ 240V, 50~60Hz input; 19VDC@3.42A, 65W


Rugged Portable Computer LB RPC 1522D-MIL
Computer System
Backplane System
PICMG 1.0 with 6x free PCI Full Size Slots and 1x CPU Slot
CPU Card
PICMG Core2Duo CPU Card with Intel 945 GME Chipset
CPU
Intel Core2Duo T7400 (2.16 GHz)
Memory
2GByte DDR2 Standard, optional up to 4 GByte
Grafik Controller
Integrated in Chipset with LVDS Interface for internal Display and VGA Port
    Storage Devices
HDD
Removable 2.5” 80GByte SATA automotive drive behind Service Door
Optical Drive
Slimline SATA DVD Writer with Tray behind Service Door
    Display
Size
381mm / 15,0” Industrial Grade TFT
Resolution
1024 x 768 pxs native XGA resolution with 16M colours
Viewing Area
381mm diagonal active view area (304.1mm x 228.1mm) (~15.0”)
Aspect Ratio
4:3 aspect ratio
Pixel Size
0,297mm pixel pitch
Viewing Angle
-75° ~ 75° typ. (H), typ. -60° ~ 50° (V)
Backlight
250 cd/m² backlight with 2 CCFL tubes, replaceable
    Interfaces
Ethernet
2x Gigabit Ethernet behind Service Door
USB
1x USB 2.0 behind Service Door, 4x USB 2.0 on CPU Board (ICD)
Serial Port
1x RS232 (COM2) behind Service Door
Parallel Port
1x IEEE1284 on CPU Board (ICD)
External Display
1x VGA behind Service Door on HD-SUB15
Connector Side Box
The unit comes with blank connector side box per default. Customers may mill their own breakthroughs for additional connectors. As alternative, customer may provide a connector list and the unit will be delivered with pre milled connector side box. Please consult factory for this option.
    Power
Supply Voltage DC
10V-32V DC input on IP65 Round Connector
Supply Voltage AC
90V-240V with 45Hz-400Hz on IP65 Round Connector
UPS (as Option)
Integrated UPS with Battery for approx. 10~15min. Runtime
UPS Monitoring
Monitoring with Serial Interface (COM1) with legacy driver in Windows XP pro
    Mechanics
Material
Precision milled aluminum enclosure
Coating / Painting
Surtec 650 surface treatment, Olive powder coating
Outside Dimensions
(H)198mm x (W)491mm x (D)474mm outside dimension
TFT Protection
Hardened non-reflecting protection glass
Special Features
Drives behind Service Door, Front sided fully environmental sealed Heat Exchanger
Weight
Approx. 20 kg
    Environmental Conditions
Temperature
MIL-STD 810F Method 501.4, Proc I (71°C) & II (50°C) (High Temp)
MIL-STD 810F Method 502.4, Proc I (-40°C) & II (-20°C) (Low Temp)
MIL-STD 810F Method 503.4, -40° to 71°C non-operating
Humidity
MIL-STD-810F Method 507.4, 5 cycles á 48h each at +30°C…+60°C at 95% rh
Operating Altitude
MIL-STD 810F Method 500.4 Proc I 15 kft & Proc II 10 kft
Fungus
MIL-STD 810F Method 508.5, Aspergillus niger, Aspergillus flavus, Aspergillus versicolor, Penicillium funiculosum, Chaetomium globosum
Contamination
MIL-STD 810F Method 504, Fuels (F-34), Hydraulic Oil (MIL-H-5606), Lubricant Oil (O-156), Coolant dielectric fluid (S-1748)
Vibration
MIL-STD 801F Method 514.5, Proc I (max. 2g RMS)
Shock
MIL-STD 810F Method 516.5, Proc I, Proc IV, Proc IV
Saltfog
MIL-STD 810F Method 509.4
Rain
MIL-STD 810F Method 506.4
IP Protection
IP65 (DIN EN 60259 / IEC 529) / NEMA4
    EMC / EMI
Conducted Emissions / CE
CE-EFA-1 Power Leads, 20Hz…100MHz (similar to MIL461E CE101 & CE102)
CE-EFA-2 Control and Signal Leads,20Hz…100MHz (similar to MIL461E CE101 & CE102)
CE-EFA-3 Power Leads, Exported Transients
Radiated Emissions / RE
RE-EFA-1 Electric Field, 50kHz…40GHz (similar MIL461E RE102)
Conducted Susceptibility / CS
CS-EFA-1 Power Leads, 20Hz…50kHz (similar MIL461E CS101)
CS-EFA-AGE-2 Power & Signal Leads, 50kHz…400MHz (Bulk Current Injection Method) (similar MIL461E CS114)
CS-EFA-4 Power Leads, Imported Spikes & Transients
Radiated Susceptibility / RS
RS-EFA-AGE-3 50kHz…18GHz (similar MIL461E RS101 & RS103)
Electrostatic Discharge / ESD
ESD-EFA-1
- 150pF / 330O, Air Discharge
- 4 kV, 6 kV, 8 kV, 10 kV and 12 kV on 7 test points
- 5 pulses shall be applied with a minimum period between the pulses of 10 seconds
- Positive and Negative Polarity


Rugged Convertible Notebook LB RCN 1320
Processor
Customer-side optionrPGA socket(i7-620LE BGA1288 ONLY)TDP 25W(Fanless)
Intel® Core™ i7-620LM vPro™ (4M Cache, 2.00 GHz)
TDP 18W(Fanless) (BGA)

BIOS
AMI Aptio®TAA socket
Chipset
Choice of Intel® Ibex Peak-M PCH QM57 and HM55TDP 3.5W
Main Memory
2GB DDR3-1333 MHzDual-channel SO-DIMM (up to 8GB)
Display
13.3” Wide Active Matrix TFT,WXGA 1280x8004 wires Resistive Touch Panel support1000 nits Sunlight Readable LCD with Multi-Touch screenLR Touch Panelwith AOT bonding(option)
Graphics
Intel Graphics Media Accelerator HD Graphics (GMA5700MHD)
CRT Display
Up to QXGA 2048 x 1536
Storage
2.5” SATA HDD w/S.M.A.R.T.SATA HDD 350G 5400R 2.5',With HeaterShock-mounted Removable HDD2.5” SATA SSD (Option)
Card Slot
Choice of the following options:Express Card 34/54(share with PCMCIA II option)SD Card Reader
Connectivity
WLAN :Intel WiFi Link 6200 2x2 802.11a/bgn PCIe mini card
WWAN :Gobi 2000 PCIe mini cardGPS Receiver Support
LAN : 10/100/1000Mbps
PAN : Bluetooth 2.1 + EDR
Modem : modem module 56kbps (V.92)(option)
Multi-bay
Slim type Super Multi DVD & Smartcard Reader
(for Fanless Model only)
LED Status Indicator
Power on/SuspendBattery Full /Charging/Low HDD AccessWWAN ConnectivityWLAN ConnectivityBluetooth ConnectivityCaps Locksupport 8 levels brightness adjustable
Interface
1 x Serial Port RS232 (RS-422/485 switchable)1 x D-sub for external monitor2 x USB 2.0 A ports(Host, Function, Memory Port)1 x External Antenna(GPS & WWAN switchable)2 x LAN (10/100/1000,only one support Vpro) 1 x RJ11 (option)1 x DC-in1 x SD Card Reader1 x Contact Smart Card Reader1 x Audio Jack : Ear Phone-out / optical SPDIF out1 x Audio Jack : MIC-in1 x Docking Connecter ((PoGo Pin)r)1 x SIM Card1 x fingerprint scanner1 x half-sized PCIe mini card slots for WLAN1 x full-sized PCIe mini card slots for WWAN
Audio
HD AudioBuilt-in Speaker x 2 (Total Max:4W)Microphone x 2 (array microphone)
Keyboard
US keyboardbacklight (support 8 levels brightness adjustable)(Option)IP 65
Power Management
ACPI 3.0 supported
Power
Input voltage:12V~36VInput current@24Vdc: 3.75 Amps typical (7.5 Amps max)
Battery
Li-ion 9 cells, 7800 mAh,Charging Time : 2.5hrs to 80%Li-ion 8400mAh & 9000mAh (Option)Built-in Gauge IC
AC adapter
Output : 19V DC, 90WInput : 100~240V AC, 50/60Hz Universal3 pin Compact Power Supply SystemMilitary Adapter (option)
Pointing Device
Built-in Resistive Touch Panel with StylusWater Proof Resistive Mouse Pad
Heat Dissipation
Thermal module with speed-variable fan.(TDP 35W)Fanless.(TDP 18W/25W)
Dimensions/Weight
344mm x 297.6mm x 58mmWeight < 4.1KG(Include Battery)
Security
TPM 1.2 (Trusted Platform Module)Optional Fingerprint ReaderKensington LockSmart Card Reader
Hot Key
SAS KeyRF SwitchBrightness Up / DownScreen Rotation KeyLED Backlight Keyboard Light On/Off
Durability Features
Fully ruggedMIL-STD 810G and IP65 CompliantMIL-STD 461F/E compliant (Option)
(CE101/CE102/RE102/CS101/CS114/RS101/RS103)
Additional Spec
Regulation
EMI: FCC, CESafety: CB, CUL/ULPower: EPEAT Silver, Energy Star v5.0, and EuP
Windows Certification
Compatibility: HCT V12.0 / DTMLanguage: US International Supported OS: Windows 7, Windows XP,
Environmental Specification
Operating temp: -30°C to 60°CStorage temp: -30°C to 60°CHumidity: 5% to 95% RH, non-condensing
Environmental Standard
Enclosure
Water Resistance:
According to Mil Std 810G-506.5, Procedure II., IEC 60529 Edition2.1 : 2001-02-IPx5 (International Electro technical Commission Publication)
Drop
According to Mil Std 810G-516.6, Procedure IV26 times 3 feet height free drop onto Plywood on concrete (8 corners, 12 edges and 6 faces Total 26 drops)
Temperature
High Temp: According to MIL-STD-810G 501.5 Procedures I (Storage) and II (Operation)Low Temp: According to MIL-STD-810G 502.5 Procedures I (Storage) and II (Operation)
Thermal Shock
According to MIL-STD-810G 503.5 Procedures I
Vibration
Operating:According to MIL-STD 810G 514.6 Procedure IAccording to ASTM 4169-99, Truck Assurance Level II, Schedule ENon-operating:According to MIL-STD 810G 514.6 Procedure I, category 24, general minimum integrity
Humidity
According to MIL-STD-810G 507.5 Procedures II
Altitude
According to MIL-STD-810G 500.5 Procedures I (Storage) and II (Operation)
Shock
40G DesignAccording to Mil Std 810G-516.6, Procedure I
Dust Resistance
According to MIL-STD-810G 510.5,Procedure IAccording to IEC 60529 Edition2.1 : 2001-02-IP6X (International Electrotechnical Commission Publication)
Explosive Atmosphere
According to MIL-STD-810G 511.5 Procedure I
Freeze/Thaw
According to MIL-STD-810G 524 Procedure III