Intel® Oak Trail™ Atom 1.5GHz (Z670)

Max. 2GB DDRII 800 Memory Down

32GB 1.8-inch Half-Slim SSD Installed

10.1-inch LED Backlight Screen with 5-wire Resistive Touch

1366 (W) x 768 (H) WXGA

Transflective plus type

2 x High Quality Speakers

Wi-Fi IEEE 802.11 b/g/n and Bluetooth 2.1

- ISO/IEC 1443A, 1443B, 15693
- Mifare 1K/4K, Ultralight
- NFC-IP1 Protocol

1.3 Mega-pixel, audio input (Front Bezel)
2 Mega-pixel, LED auxiliary light (Rear Bezel)

1 x Compatible with TPM 1.2

1

2

1

1

1

1

1

1

1

4+ Way Navigation button with integrated Enter button

5

2 x Barcode buttons (Programmable)

Power
Storage
Wi-Fi

277.8 (W) x 206 (H) x 26.5 (D) mm

1.2kg (2.65lb)

CE, FCC, UL, VCCI, CCC; CE/FCC SAR

WES 7-WS7E, WES-WS7P

IP54 equivalent

4-ft drop (MIL-STD-810G Method 516.6 Procedure IV)

Operating : 20g, 11ms, Terminal sawtooth.
Non-operating : 40g, 11ms, Terminal sawtooth

0°C to +40°C (32°F to 104°F)

-20°C to +60°C (-4°F to 140°F)

5-90% without condensation

Internal Smart Lithium Polymer Battery, 3800mAh

AC 100V ~ 240V, 50~60Hz input; 19VDC@3.42A, 65W

PICMG 1.0 with 6x free PCI Full Size Slots and 1x CPU Slot

PICMG Core2Duo CPU Card with Intel 945 GME Chipset

Intel Core2Duo T7400 (2.16 GHz)

2GByte DDR2 Standard, optional up to 4 GByte

Integrated in Chipset with LVDS Interface for internal Display and VGA Port

Removable 2.5” 80GByte SATA automotive drive behind Service Door

Slimline SATA DVD Writer with Tray behind Service Door

381mm / 15,0” Industrial Grade TFT

1024 x 768 pxs native XGA resolution with 16M colours

381mm diagonal active view area (304.1mm x 228.1mm) (~15.0”)

4:3 aspect ratio

0,297mm pixel pitch

-75° ~ 75° typ. (H), typ. -60° ~ 50° (V)

250 cd/m² backlight with 2 CCFL tubes, replaceable

2x Gigabit Ethernet behind Service Door

1x USB 2.0 behind Service Door, 4x USB 2.0 on CPU Board (ICD)

1x RS232 (COM2) behind Service Door

1x IEEE1284 on CPU Board (ICD)

1x VGA behind Service Door on HD-SUB15

The unit comes with blank connector side box per default. Customers may mill their own breakthroughs for additional connectors. As alternative, customer may provide a connector list and the unit will be delivered with pre milled connector side box. Please consult factory for this option.

10V-32V DC input on IP65 Round Connector

90V-240V with 45Hz-400Hz on IP65 Round Connector

Integrated UPS with Battery for approx. 10~15min. Runtime

Monitoring with Serial Interface (COM1) with legacy driver in Windows XP pro

Precision milled aluminum enclosure

Surtec 650 surface treatment, Olive powder coating

(H)198mm x (W)491mm x (D)474mm outside dimension

Hardened non-reflecting protection glass

Drives behind Service Door, Front sided fully environmental sealed Heat Exchanger

Approx. 20 kg

MIL-STD 810F Method 501.4, Proc I (71°C) & II (50°C) (High Temp)
MIL-STD 810F Method 502.4, Proc I (-40°C) & II (-20°C) (Low Temp)
MIL-STD 810F Method 503.4, -40° to 71°C non-operating

MIL-STD-810F Method 507.4, 5 cycles á 48h each at +30°C…+60°C at 95% rh

MIL-STD 810F Method 500.4 Proc I 15 kft & Proc II 10 kft

MIL-STD 810F Method 508.5, Aspergillus niger, Aspergillus flavus, Aspergillus versicolor, Penicillium funiculosum, Chaetomium globosum

MIL-STD 810F Method 504, Fuels (F-34), Hydraulic Oil (MIL-H-5606), Lubricant Oil (O-156), Coolant dielectric fluid (S-1748)

MIL-STD 801F Method 514.5, Proc I (max. 2g RMS)

MIL-STD 810F Method 516.5, Proc I, Proc IV, Proc IV

MIL-STD 810F Method 509.4

MIL-STD 810F Method 506.4

IP65 (DIN EN 60259 / IEC 529) / NEMA4

CE-EFA-1 Power Leads, 20Hz…100MHz (similar to MIL461E CE101 & CE102)
CE-EFA-2 Control and Signal Leads,20Hz…100MHz (similar to MIL461E CE101 & CE102)
CE-EFA-3 Power Leads, Exported Transients

RE-EFA-1 Electric Field, 50kHz…40GHz (similar MIL461E RE102)

CS-EFA-1 Power Leads, 20Hz…50kHz (similar MIL461E CS101)
CS-EFA-AGE-2 Power & Signal Leads, 50kHz…400MHz (Bulk Current Injection Method) (similar MIL461E CS114)
CS-EFA-4 Power Leads, Imported Spikes & Transients

RS-EFA-AGE-3 50kHz…18GHz (similar MIL461E RS101 & RS103)

ESD-EFA-1
- 150pF / 330O, Air Discharge
- 4 kV, 6 kV, 8 kV, 10 kV and 12 kV on 7 test points
- 5 pulses shall be applied with a minimum period between the pulses of 10 seconds
- Positive and Negative Polarity

Customer-side optionrPGA socket(i7-620LE BGA1288 ONLY)TDP 25W(Fanless)
Intel® Core™ i7-620LM vPro™ (4M Cache, 2.00 GHz)
TDP 18W(Fanless) (BGA)

AMI Aptio®TAA socket

Choice of Intel® Ibex Peak-M PCH QM57 and HM55TDP 3.5W

2GB DDR3-1333 MHzDual-channel SO-DIMM (up to 8GB)

13.3” Wide Active Matrix TFT,WXGA 1280x8004 wires Resistive Touch Panel support1000 nits Sunlight Readable LCD with Multi-Touch screenLR Touch Panelwith AOT bonding(option)

Intel Graphics Media Accelerator HD Graphics (GMA5700MHD)

Up to QXGA 2048 x 1536

2.5” SATA HDD w/S.M.A.R.T.SATA HDD 350G 5400R 2.5',With HeaterShock-mounted Removable HDD2.5” SATA SSD (Option)

Choice of the following options:Express Card 34/54(share with PCMCIA II option)SD Card Reader

WLAN :Intel WiFi Link 6200 2x2 802.11a/bgn PCIe mini card
WWAN :Gobi 2000 PCIe mini cardGPS Receiver Support
LAN : 10/100/1000Mbps
PAN : Bluetooth 2.1 + EDR
Modem : modem module 56kbps (V.92)(option)

Slim type Super Multi DVD & Smartcard Reader
(for Fanless Model only)

Power on/SuspendBattery Full /Charging/Low HDD AccessWWAN ConnectivityWLAN ConnectivityBluetooth ConnectivityCaps Locksupport 8 levels brightness adjustable

1 x Serial Port RS232 (RS-422/485 switchable)1 x D-sub for external monitor2 x USB 2.0 A ports(Host, Function, Memory Port)1 x External Antenna(GPS & WWAN switchable)2 x LAN (10/100/1000,only one support Vpro) 1 x RJ11 (option)1 x DC-in1 x SD Card Reader1 x Contact Smart Card Reader1 x Audio Jack : Ear Phone-out / optical SPDIF out1 x Audio Jack : MIC-in1 x Docking Connecter ((PoGo Pin)r)1 x SIM Card1 x fingerprint scanner1 x half-sized PCIe mini card slots for WLAN1 x full-sized PCIe mini card slots for WWAN

HD AudioBuilt-in Speaker x 2 (Total Max:4W)Microphone x 2 (array microphone)

US keyboardbacklight (support 8 levels brightness adjustable)(Option)IP 65

ACPI 3.0 supported

Input voltage:12V~36VInput current@24Vdc: 3.75 Amps typical (7.5 Amps max)

Li-ion 9 cells, 7800 mAh,Charging Time : 2.5hrs to 80%Li-ion 8400mAh & 9000mAh (Option)Built-in Gauge IC

Output : 19V DC, 90WInput : 100~240V AC, 50/60Hz Universal3 pin Compact Power Supply SystemMilitary Adapter (option)

Built-in Resistive Touch Panel with StylusWater Proof Resistive Mouse Pad

Thermal module with speed-variable fan.(TDP 35W)Fanless.(TDP 18W/25W)

344mm x 297.6mm x 58mmWeight < 4.1KG(Include Battery)

TPM 1.2 (Trusted Platform Module)Optional Fingerprint ReaderKensington LockSmart Card Reader

SAS KeyRF SwitchBrightness Up / DownScreen Rotation KeyLED Backlight Keyboard Light On/Off

Fully ruggedMIL-STD 810G and IP65 CompliantMIL-STD 461F/E compliant (Option)
(CE101/CE102/RE102/CS101/CS114/RS101/RS103)

EMI: FCC, CESafety: CB, CUL/ULPower: EPEAT Silver, Energy Star v5.0, and EuP

Compatibility: HCT V12.0 / DTMLanguage: US International Supported OS: Windows 7, Windows XP,

Operating temp: -30°C to 60°CStorage temp: -30°C to 60°CHumidity: 5% to 95% RH, non-condensing

Water Resistance:
According to Mil Std 810G-506.5, Procedure II., IEC 60529 Edition2.1 : 2001-02-IPx5 (International Electro technical Commission Publication)

According to Mil Std 810G-516.6, Procedure IV26 times 3 feet height free drop onto Plywood on concrete (8 corners, 12 edges and 6 faces Total 26 drops)

High Temp: According to MIL-STD-810G 501.5 Procedures I (Storage) and II (Operation)Low Temp: According to MIL-STD-810G 502.5 Procedures I (Storage) and II (Operation)

According to MIL-STD-810G 503.5 Procedures I

Operating:According to MIL-STD 810G 514.6 Procedure IAccording to ASTM 4169-99, Truck Assurance Level II, Schedule ENon-operating:According to MIL-STD 810G 514.6 Procedure I, category 24, general minimum integrity

According to MIL-STD-810G 507.5 Procedures II

According to MIL-STD-810G 500.5 Procedures I (Storage) and II (Operation)

40G DesignAccording to Mil Std 810G-516.6, Procedure I

According to MIL-STD-810G 510.5,Procedure IAccording to IEC 60529 Edition2.1 : 2001-02-IP6X (International Electrotechnical Commission Publication)

According to MIL-STD-810G 511.5 Procedure I

According to MIL-STD-810G 524 Procedure III